The article discusses the technological development trends of Flexible Printed Circuits (FPC), highlighting advancements in circuit density, manufacturing processes, and materials, particularly the evolution of polyimide resins to meet increasing performance demands.
Trends in Flexible Printed Circuit Board (FPC) Technology Read More »
The basic structure of a Flexible Printed Circuit (FPC) traditionally involves copper foil on a polyimide base with adhesive layers, but advancements now include adhesive-free laminates to enhance heat resistance, reduce thickness, and improve mechanical properties, enabling the production of high-density and multilayer circuits.
Advancements and trends in FPC technology and materials. Read More »
Advancements in Flexible Printed Circuit (FPC) technology aim for high-density circuits and reliability, driven by demands for compactness in electronic devices, utilizing methods like subtractive etching or semi-additive electroforming for smaller pitches and via holes.
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