high-frequency circuit

Grasp the essential principles of RF PCB design.

In RF PCB design, careful component layout, impedance control, grounding, and shielding are essential to ensure stable performance and minimize interference, with key considerations including structural requirements, trace routing, and multi-point grounding for the RF section.

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EMI Control Techniques for PCBs

High-current circuits should be avoided in central board area, consider heat dissipation and radiation effects, place connector away from high-frequency circuit, place decoupling capacitor near power pin, consider power supply division layout feasibility, place multi-power devices across boundary to reduce EMI impact.

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Design and implement high-frequency circuit PCB board layouts and wiring configurations.

Designing high-frequency circuits requires careful consideration of multilayer board wiring, minimizing lead bends and lengths, reducing vias, managing crosstalk, adding decoupling capacitors, isolating ground wires, avoiding loops, ensuring impedance matching, and maintaining signal integrity.

Design and implement high-frequency circuit PCB board layouts and wiring configurations. Read More »

The concept and design principles of high frequency circuits and PCB boards

For high-frequency circuit PCB board design, excellent CAD software is available to compensate for the lack of experience and tedious parameter retrieval and calculation. However, in practice, many RF engineers fail to apply basic design principles and experience, leading to design errors and issues with the CAD software.

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