High-frequency PCB substrate requirements and characteristics
High-frequency circuit boards require substrates with low and stable dielectric constants (Dk), minimal dielectric loss, consistent thermal expansion coefficients of copper foil, and properties such as heat and chemical resistance, impact strength, and peel strength. These materials are crucial for maintaining signal integrity and operational stability, particularly in applications above 1GHz where Teflon-based substrates like FR4 are commonly used to optimize performance.
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