high porosity

Reasons of Poor Plating During PCB Electroplating

Poor plating during PCB electroplating can be attributed to mold contamination, moss pollution, high porosity, inconsistent coating thickness, black spots caused by leaking hanger packages, workpiece discoloration, tin tumors, and color variations due to improper chemical reactions.

Reasons of Poor Plating During PCB Electroplating Read More »

Reasons of Poor Plating During PCB Electroplating

Poor plating during PCB electroplating can be attributed to mold contamination, moss pollution, high porosity, inconsistent coating thickness, black spots caused by leaking hanger packages, workpiece discoloration, tin tumors, and color variations due to improper chemical reactions.

Reasons of Poor Plating During PCB Electroplating Read More »

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