As PCB designs become more complex with higher performance requirements, engineers face increasing challenges in signal integrity, power integrity, EMC/EMI, and thermal analysis, making advanced simulation tools essential for efficient and high-quality design amidst tight product delivery deadlines.
High-speed and high-density PCB design presents numerous challenges. Read More »
In high-speed PCB design, vias are crucial for interlayer connections, but their parasitic capacitance and inductance can significantly affect signal integrity at frequencies above 1 GHz, making careful via design essential to minimize these negative impacts.
Are you familiar with via design considerations in high-speed PCBs? Read More »
Effective PCB routing is crucial for high-speed design, with decisions on right-angle routing, differential routing, and serpentine traces significantly impacting signal integrity and system performance.
Ground bounce is noise caused by rapidly changing currents in a loop, leading to voltage differences that mainly affect the receiving end of a circuit, and can be mitigated by minimizing current variations and return path inductance.
A multi-layer PCB board consists of several insulating layers with additional power and grounding layers, providing high assembly density, compact size, and effective shielding, while requiring careful design to ensure symmetry, reduce interference, and align with product structure.
Master These 6 Essential Skills for Designing Multilayer PCB Boards Read More »
The importance of layer placement in PCB design, emphasizing that correct positioning of signal, power, and ground layers, along with proper impedance control and isolation techniques, is crucial for ensuring effective board performance, particularly in high-speed and high-frequency applications.
In high-speed PCB, circuit wiring is a complex knowledge vehicle involving resistors, capacitors, and inductors with reflected signal measurements based on transmission line impedance and load impedance. The detailed analysis reveals the process of signal reflection and transmission delay in a mismatched impedance transmission line.
Managing signal reflections in high-speed PCB design. Read More »
Cadence Allegro has almost become the industrial standard in high-speed PCB board design, and attention should be paid to routing high-frequency PCB signals, improving the electrical performance of the board, adding decoupling capacitors strategically, ensuring reasonable layout, minimizing the use of blind holes for signals, dividing electric layers, and considering serpentine routing for high-speed signals.
Need to fix placement of high-speed line on a PCB, specifically for a high-speed DAC. Considering resistor replacement for reducing ringing/overshoot.
An issue with a high-speed printed circuit board (PCB). Read More »
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