With the rapid development of the electronic industry, PCBs are evolving towards high density and precision, with different types of drilling holes emerging to meet production needs, such as through holes, blind holes, and buried holes. In high-speed PCB design, efforts can be made to reduce the adverse effects of parasitic effects caused by vias, such as choosing reasonable via hole sizes, using thinner PCB boards, minimizing unnecessary vias, and optimizing the placement of power and ground vias.