The printed circuit board sector is shifting from traditional tin-lead eutectic treatments to alternatives like Organic Solderability Preservative (OSP), with the newly developed high-temperature resistant OSP (HTOSP) films showing superior heat resistance and solderability, validated through advanced analytical techniques.
The transition from lead to lead-free surface treatment in the electronics industry has led to the adoption of OSP films, with the new high-temperature OSP film demonstrating superior heat resistance and solderability compared to industry-standard OSP films.
Performance Evaluation of OSP Film in Lead-Free PCB Copy Board Process Read More »
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