Emergency methods for addressing BGA integrated circuit soldering issues include using solder paste to enhance solder ball adhesion, employing a hot air gun to heat the chip evenly, and applying moderate pressure to ensure proper contact between the solder balls and the PCB. These methods are crucial for effective repair under non-professional conditions.
Defects in Reflow Soldering and BGA Package Circuits Read More »
To remove tin in circuit board processing, methods include direct hot air gun blow, tin suction device disassembly, medical hollow needle disassembly, and electric soldering iron brush cooperative disassembly.
Six Common Methods for Tin Removal in Circuit Board Processing Part 1 Read More »
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