The IC presents three challenges that need to be addressed.
IC carrier boards, likened to the “crown of PCB,” are pivotal in chip packaging, constituting a substantial portion of material costs and symbolizing quality in high-end products. Yet, their capital-intensive nature, demanding technical requirements, and stringent customer certifications pose formidable barriers to entry, limiting access to this prestigious segment of the market for many PCB enterprises.
The IC presents three challenges that need to be addressed. Read More »