packaging principles and functional characteristics of commonly used ICs, aiding electronic engineers in precise IC selection for circuit design. It emphasizes the importance of understanding various IC packaging types for efficient factory batch production programming and matching IC package and burner models.
Summary of IC Packaging Principles and Functional Characteristics Read More »
AOI systems have revolutionized SMT assembly by replacing manual inspections with imaging technology to detect component defects, though limitations persist despite advancements in detecting obscured regions and achieving a perfect inspection rate.
Advantages and disadvantages of Automated Optical Inspection (AOI) Read More »
QFN packaging offers size efficiency, cost-effectiveness, high yield rates, and superior electrical performance compared to traditional packages, but its leadless design poses challenges in soldering quality and joint identification, especially on the sides prone to oxidation.
Comprehensive Examination of Soldering Quality in QFN Packages: Part One Read More »
QFN packaging offers advantages like small size, cost-effectiveness, and high yield but poses challenges in soldering quality, requiring electrical measurements and optical sensors for inspection.
In-Depth Examination of the Soldering Quality of QFN Packages Read More »
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