The emergence of lead-free PCB boards has introduced new challenges for in-circuit testing, emphasizing the importance of probe reliability and ICT contact points. Different surface treatment processes such as HASL, OSP, ENIG, silver immersion, and tin immersion have varying impacts on ICT reliability, with OSP requiring specific rules to prevent contact issues. Silver immersion shows promise as a natural alternative to HASL, providing reliable test contact without the need for fixture adjustments. Overall, ICT engineers should carefully evaluate the impact of surface treatment processes on ICT performance to ensure optimal testing results.