Surface treatments for PCB circuit boards, such as tin spraying (HASL), OSP, and immersion gold (ENIG), protect the copper from oxidation, enhance solderability, and meet the evolving needs of modern electronics, but each has its own advantages, limitations, and environmental considerations.
PCBA plate making is critical, with gold plating and tin plating processes being especially important for enhancing corrosion resistance and solderability.
The processes of PCB assembly involving gold plating and tin plating Read More »
Surface treatments for printed circuit boards (PCBs) encompass various methods like gold plating, tin spraying, immersion gold, immersion silver, and OSP. These treatments cater to different needs, offering advantages such as oxidation resistance, good solderability, and environmental friendliness. Gold plating, though costly, remains vital for high-performance connectors, while tin plating predominates due to lower costs, especially in mainstream electronics like motherboards and memory modules. Immersion gold boards mitigate issues like the tin whisker effect, providing superior solderability and flatness, making them increasingly preferred in modern PCB applications.
PCB immersion gold and gold plating are surface treatment techniques that enhance PCB durability and performance by applying thin gold coatings. Immersion gold (ENIG) involves a chemical bath deposition, forming a thicker gold layer through a redox reaction.
Differences: PCB Immersion Gold vs. Gold Plating in 80 characters Read More »
Various surface treatment options are available in PCB production, each differing in price and process; today, we focus on OSP treatment. OSP PCBs require careful handling, storage, and solder paste application to maintain quality and longevity.
Immersion Gold (ENIG) is a surface treatment process that involves plating gold onto copper to prevent oxidation and improve conductivity, while Gold Finger refers to a row of equidistant square pads on a PCB circuit board used for electrical connections. The categories of PCB gold fingers include ordinary gold fingers, segmented gold fingers, and long and short gold fingers.
Various surface treatment processes, such as electroless nickel/immersion gold, immersion silver, and immersion tin, are used for PCBs to meet connection requirements and reduce costs. The future direction of PCB surface treatment processes is uncertain, but customer demands and environmental protection should be prioritized.
Choosing the Suitable Surface Treatment Process for PCBs Read More »
The manufacturing process of various types of PCB boards involves cutting material, baking board, drilling, copper sinking, circuit formation, etching, testing, quality control, surface treatment, silk screen printing, finishing, testing, packaging, and shipping.
PCB prototyping and small to medium batch circuit board manufacturing process Read More »
Various surface treatment processes, such as electroless nickel/immersion gold, immersion silver, and immersion tin, are used for PCBs to meet connection requirements and reduce costs. The future direction of PCB surface treatment processes is uncertain, but customer demands and environmental protection should be prioritized.
Choosing the Suitable Surface Treatment Process for PCBs Read More »
The manufacturing process of various types of PCB boards involves cutting material, baking board, drilling, copper sinking, circuit formation, etching, testing, quality control, surface treatment, silk screen printing, finishing, testing, packaging, and shipping.
PCB prototyping and small to medium batch circuit board manufacturing process Read More »
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