The immersion gold process is a costly surface treatment for circuit boards, essential for specific applications like gold fingers and fine line widths, but less suitable for others, and it offers advantages in heat dissipation, soldering strength, and measurement reliability compared to alternative methods like OSP and silver treatments.
The Unique Role of the PCB Immersion Gold Process Read More »
FPC cables, flexible and designed for dynamic movement, feature a rolled copper base for resilience, are commonly surface-treated with immersion gold, and are essential in compact devices needing reliable electrical connections.
Current capacity of FPC flexible cables and metal sheets for FPC applications. Read More »
Immersion Gold (ENIG) provides long-term PCB protection with a nickel-gold layer for superior electrical performance and environmental resistance, while its process complexity and potential for black pad formation can impact solder joint reliability.
Integrated processing of PCB surface treatments. Read More »
The immersion gold process improves PCB board quality and performance by preventing oxidation and providing a stable, bright, and solderable coating, enhancing reliability and functionality.
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