The impact of different electroplating finishes on PCB rapid prototyping, conductor loss, and insertion loss is evaluated through both measurements and simulations, showing that thicker PCB materials tend to have lower insertion loss, and plating finishes introduce additional conductor losses, with bare copper generally exhibiting the least loss.
Analysis of PCB Conductors and Multilayer Boards Read More »
A PCB transmission line’s loss, known as insertion loss (αt), combines conductor loss (αc), dielectric loss (αd), radiation loss (αr), and leakage loss (αl), with a focus on conductor and dielectric losses influenced by signal trace resistance and dielectric properties.
What signal degradation occurs in the transmission line of the circuit board? Read More »
PCB designers can optimize signal integrity and manage EMI by leveraging techniques like high-speed materials, controlling impedance, and field containment, as emphasized in industry resources like Ralph Morrison’s book and insights from experienced professionals like Dan Beeker.
The design and manufacturing of PCB boards play a crucial role in determining the performance indicators of the six types of modules, with important parameters including insertion loss, return loss, and near-end crosstalk. Failure mechanisms such as signal leakage from modules and plugs can be addressed through approaches like balanced transmission and high-speed communication connector manufacturing. Domestic counterparts need to focus on designing compensation circuits and optimizing process parameters for successful trial production of super six-type modules.
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