Inspection

Anti-Static Cardboard for SMT Chip Processing: Key to ESD Prevention

Regularly inspect and maintain anti-static equipment and containers, utilize proper PCB trays for protection during transportation, and ensure operators wear appropriate electrostatic protection gear for quality PCB production in SMT workshops.

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Precautions for SMT Component Utilization: Part 1

WellCircuits Limited rigorously follows ISO standards for internal quality control, conducting thorough inspections on incoming components and promptly returning goods failing to meet national standards, while strictly adhering to guidelines for component storage and usage, especially regarding environmental conditions and moisture-proof measures. As a reputable FPC soft board manufacturer, WellCircuits Limited is dedicated to supporting both existing and new customers with their inquiries and needs.

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In-Depth Analysis of QFN Package Soldering Quality: Part 2

2. For QFN solderability inspection and testing, electrical tests along with optical sensors or X-rays are used to detect solder issues; poor X-ray imaging can make identifying problems challenging, sometimes requiring destructive experiments like inspecting BGA solder. 3. To address voids in QFN solder joints, solutions include conducting solderability tests, revising circuit board wiring designs, introducing thermal resistance pads, adjusting reflow soldering parameters, and redesigning ground pads to prevent excessive solder paste application and floating parts.

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