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Manufacturing Process of Copper Clad Laminate for PCBs

PCB board copper clad laminate is a substrate material used for making printed circuit boards, supporting components while enabling electrical connections or insulation. The manufacturing process involves impregnating materials like glass fiber cloth or paper with adhesives such as epoxy or phenolic resin, followed by lamination with copper foil and application of heat and pressure to create the final laminate.

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What are the Distinctions between Ceramic PCBs and Standard PCBs?

Ceramic PCB boards offer excellent thermal conductivity and insulation, making them ideal for heat dissipation applications in industries like LED lighting and high-power modules. Compared to regular PCB boards, ceramic PCB boards are made of different materials and have different applications, while a combination of ceramic and high-frequency boards may be necessary in certain scenarios. When selecting ceramic substrates, it is important to consider quality parameters, craftsmanship, conduct trials, and research information from reputable manufacturers.

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The utilization and efficiency of FR4 fiberglass fabric.

FR4 fabric glass is a fabric woven from glass fibers with insulation, thermal insulation, corrosion resistance, non-combustibility, high temperature resistance, and high strength, widely used in various fields and categorized into different types for specific uses.

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