intermetallic compounds

Techniques to Enhance the Bonding Strength of PCBA Solder Joints

Improving PCBA bonding strength can be achieved through various methods, primarily by opting for copper-based surface treatments over nickel-based ones, as they typically create stronger intermetallic compounds, although each approach has its own advantages and challenges.

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Selecting PCB Surface Treatments: Expert Guide

The evolution of PCB surface treatment technology, influenced by environmental concerns and evolving industry standards, emphasizes lead-free and halogen-free processes like organic coating and electroless nickel plating/immersion gold, while also considering factors like component type and assembly requirements, leading to a dynamic landscape of options with a focus on meeting customer needs and environmental standards.

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Causes of Cold Soldering Issues in PCB Reflow Soldering Processes

Gold is commonly used in FR4-PCB welding due to its stability, but excessive gold content can weaken solder joint mechanical strength, leading to incomplete reflow and cold welding issues. Various factors such as intermetallic compound formation, base metal composition, reflow parameters, and flux activity can also contribute to these problems.

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