Various PCB prototyping techniques
Which aspects of the article would you like to enhance: language fluency or technical details?
jlc pcb
Concise Analysis of PCBA Process Flow and Terminology Fundamentals
PCBA, or Printed Circuit Board Assembly, involves the SMT and DIP processes to turn a bare PCB into a functional electronic product, with various assembly methods depending on component placement and production requirements.
Concise Analysis of PCBA Process Flow and Terminology Fundamentals Read More »
Analysis and Optimization of Burst Plates in PCB Reflow Soldering
This document analyzes PCB board burst phenomena during reflow soldering, detailing the impact of moisture absorption, poor adhesion, inappropriate reflow temperatures, and design flaws, while suggesting improvements for enhanced soldering reliability.
Analysis and Optimization of Burst Plates in PCB Reflow Soldering Read More »
Dielectric Constants of PCB Samples
FR4 PCBs experience significant changes in dielectric constant and signal delay due to temperature and frequency variations, impacting filtering performance, which can be managed by using capacitors with appropriate ESR values to address resonance issues.
PCB fabrication techniques and the benefits of mSAP (modified semi-additive process).
The three PCB manufacturing methods—Subtractive, MSAP (Modified Semi-Additive Process), and SAP (Semi-Additive Process)—vary in their approaches to creating circuit patterns, with MSAP offering the highest precision and smallest trace widths for advanced circuit density and impedance control.
PCB fabrication techniques and the benefits of mSAP (modified semi-additive process). Read More »
Review of Double-Sided PCB Board Duplication Techniques and their Drawing Outcomes
The PCB board copying process involves scanning the board, documenting components, converting images to files, creating a new PCB layout in software, and ensuring all layers and components align correctly before sending it for production and testing.
Review of Double-Sided PCB Board Duplication Techniques and their Drawing Outcomes Read More »
Typical Issues and Solutions for ENIG PCB Finishes
The issues and improvement measures related to ENIG plating processes involve controlling chemical concentrations, ensuring thorough cleaning and proper equipment maintenance, and monitoring various operational parameters to avoid defects like leakage plating, poor weldability, and corrosion.
Typical Issues and Solutions for ENIG PCB Finishes Read More »