Green PCBs dominate the electronics industry due to their visibility during processing, environmental friendliness, and ease of inspection, despite no impact on performance, while various other colors are used primarily for differentiation.
The aesthetic appearance of the green PCB substrate. Read More »
The common quality inspections in PCBA processing include material testing, incoming material verification, solder inspections, PCB board checks, solder paste management, SMT machine adjustments, reflow soldering control, and final QA inspections to ensure product quality before delivery.
The most prevalent quality inspection method in PCBA manufacturing. Read More »
PCBA processing involves repeated aging tests to evaluate stability under simulated operational conditions, requiring precautions like wearing anti-static gloves and using grounded meters and anti-static surfaces.
What key factors should I consider when testing PCBA manufacturing processes? Read More »
The article outlines PCB design considerations for integrating ARM Cortex-M microcontrollers, specifically focusing on the STM32F4 series, while detailing aspects like power supply design, clock configuration, GPIO functionality, and communication interfaces such as I2C and SPI.
PCB Design Seminar: Techniques for Designing Microcontroller Circuits Read More »
The article discusses the PCB double-sided reflow process, highlighting the importance of component placement—smaller components should be on the first side to minimize detachment risk during the second reflow, while larger and temperature-sensitive components should be on the second side to prevent damage and ensure quality soldering.
The effective use of scrapers in PCBA processing hinges on optimal angle, speed, pressure, width, printing gap, separation speed, and material, ensuring efficient solder paste application and print quality.
Scraper utilized in PCBA manufacturing and assembly processes. Read More »
The article reviews the advancements in micro-hole drilling technology for printed circuit boards (PCBs), emphasizing the importance of cover and backing plates in improving hole quality and processing efficiency, while noting the challenges faced in drilling rigid, flexible, and rigid-flex boards and the need for further research on optimal material combinations and drilling characteristics.
Micro-drilling Technology for PCB Cover and Backing Plate Read More »
A four-layer PCB enhances EMC by over 20 dB compared to a two-layer board, allowing for dedicated ground and power planes, and utilizes various grounding methods, including single, multipoint, and mixed grounding, to minimize noise and improve performance in high-frequency applications.
The 8D method for addressing PCB board issues involves nine structured steps that guide teams in identifying, analyzing, and resolving problems while ensuring effective communication and documentation throughout the process.
China’s electronics industry is rapidly growing, with key trends of integration and miniaturization driving increased demands for technical research and development in PCBA processes, which require high-quality components, advanced equipment, and strict quality management systems for excellence.
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