The study found that the dielectric constant variations due to glass fiber weaves in PCBs significantly impact the performance of millimeter-wave radar antennas, with antennas using RO4830 laminates showing superior performance compared to those with RO4835 laminates.
Millimeter wave radar performance is influenced by the design and structure of Read More »
Effective thermal design in electronic equipment involves managing heat from various components to maintain reliability and longevity by employing methods for heat generation reduction and efficient dissipation, with the ultimate goal of controlling temperature within acceptable limits.
Thermal Design Analysis of High-Frequency Switching Power Supply Boards Read More »
Solder pads on PCBs are metal contact points used for attaching components, created through copper coating, and come in various types (pin pads, surface mount pads, and through-hole pads) with specific functions and designs, while vias are small holes facilitating inter-layer connections.
layout, wiring, or electromagnetic compatibility?
layout, wiring, or electromagnetic compatibility Read More »
For mounting SMD components on FPC boards, choose between multi-chip or high-precision placement methods based on component type, quantity, and accuracy needs, ensuring proper fixation, solder paste handling, and reflow soldering parameters to maintain low defect rates.
Solutions for Mounting SMD Components on FPCs (Flexible Printed Circuits) Read More »
Ground bounce is noise caused by rapidly changing currents in a loop, leading to voltage differences that mainly affect the receiving end of a circuit, and can be mitigated by minimizing current variations and return path inductance.
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