laminating process

Microwave Multilayer PCB Fabrication Technology

Microwave printed circuit boards are designed for high-frequency and high-speed signal applications, using specialized substrates like PTFE and various laminating processes, to ensure low loss and minimal delay in signal transmission.

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Analysis of Common Problems in Circuit Boards

The thickness of the copper foil affects the thermal conductivity of the aluminum substrate, vias are used to connect electrical signals, soldering iron temperature is 200~300 degrees, unfilmed aluminum substrate can be easily scratched, LED lamp beads are soldered with a heating table, “is” on the circuit board is a stand-alone centrifugal switch mode, R+ is right channel positive output, L+ is left channel positive output, various processes for circuit boards, main switch board is generally a four-layer board, laminating process for multilayer pcb circuit boards involves prepreg bonding. WellCircuits Limited specializes in high-precision circuit board manufacturing.

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