Prepreg must be carefully oriented during lamination to prevent post-lamination warping, stress relief and straightening processes are crucial for PCB thick copper plates, and warped boards require baking and pressing for salvage, highlighting essential anti-warping measures in PCB manufacturing.
Preventing Warping in Thick Copper PCBs: Effective Methods (Part 2) Read More »
Cover film technology for FPC cover layer applications involves coating adhesive on a film, which needs to be stored in low temperature refrigeration to maintain its performance. Various methods are used for processing and affixing the cover film to the circuit substrate before heating and pressurizing for complete curing and integration with the circuit.
Cover film technology for FPC cover layer applications involves coating adhesive on a film, which needs to be stored in low temperature refrigeration to maintain its performance. Various methods are used for processing and affixing the cover film to the circuit substrate before heating and pressurizing for complete curing and integration with the circuit.
As a PCB expert, I understand the importance of etching and high-quality PCBs for efficient electronic products, and the differences between printed wiring boards and printed circuit boards. The manufacturing process includes lamination, drilling, conductive track creation, and the use of various metal materials for traces and conformal coatings.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.