Multilayer circuit boards, consisting of 10 to 20 layers or more, are complex to process, requiring high quality and reliability. They find primary use in communication equipment, high-end servers, medical electronics, aviation, industrial control, military, and other fields. Despite the demand in various sectors, the production of multilayer boards is challenging due to difficulties in layer alignment, inner layer fabrication, lamination, and drilling, as well as stringent reliability testing requirements.