4-Layer Ultra-Thin 0.25mm High-Density HDI PCB
As the electronic products become thinner and smaller the thickness and volume of PCB installed in these devices are smaller which promotes the gradual maturity of HDI technology resulting in ultra
Laser Drilling
Utilization of Laser Technology in Multilayer PCB Manufacturing
Laser PCB processing technology involves cutting, welding, surface treatment, and other techniques using lasers across various industries, including automotive, aerospace, and electronics.
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High-Reliability HDI PCB
HDI technology drives innovation in PCB manufacturing, enabling precise, high-density interconnections through 0.1mm laser drilling, crucial for meeting evolving industry demands and advancing electronic progress.
“PCB Production of HDI Blind Hole Boards”
The demand for high-density circuit boards drives the evolution towards High-Density Interconnect (HDI) technology by minimizing through-holes and implementing precise blind and buried vias, while considering factors like laser hole sleeving and film formatting.
Common PCB Drilling Techniques Employed by Circuit Board Manufacturers
With advancing product performance, PCBs undergo continual updates and development, necessitating denser circuits despite shrinking sizes. Precise drilling techniques, including mechanical, laser, plasma, and chemical methods, are vital for accommodating more components efficiently while minimizing costs and time.
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Laser Drilling Process and Common Solutions for Problems in HDI Products No. 3
This article addresses common quality problems in laser drilling, including misalignment and incorrect hole patterns, and provides technological measures to address these issues.
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