The solder paste printing test requires using a soldered PCB for accurate thermocouple testing, selecting representative test points based on temperature zones, securely attaching thermocouples, and analyzing the temperature curve data to ensure proper reflow soldering without exceeding temperature limits.
How to Determine the Temperature Tolerance of a PCB Read More »
The transition to lead-free solder in electronics, driven by legislation in Japan and the EU, aims to mitigate environmental pollution and health risks associated with lead, while facing challenges like brittleness and poor wettability in new solder compositions.
PCBA Seminar: Overview of Lead-Free Soldering Techniques Read More »
Lead-free soldering technology impacts PCB components by necessitating adjustments in soldering processes, temperature management, and handling of complex designs, while generally allowing for a smooth transition with minimal process changes.
Lead-free printed circuit boards and intricate PCB assemblies Read More »
1. Selective soldering in the PCB electronics industry offers advantages over traditional wave soldering by focusing solder application on specific areas, reducing costs, and accommodating sensitive components, thereby driving its increased adoption.
Analysis of Challenges in the Selective Soldering Process of PCBs Read More »
The pursuit of lead-free soldering in the global electronic industry has been challenging due to the rigorous requirements of finding a suitable lead-free tin, with the current substitute, Sn-Ag-Cu alloy experiencing drawbacks such as high melting point and poor wettability. Countermeasures such as technical training, electric soldering irons with PID temperature control, and careful selection of solder wire are commonly utilized to address these challenges.
Challenges and strategies for lead-free soldering of FR4 PCBs Read More »
The potential bursting of FR4 PCBs during back welding is a result of the high heat stress and thermal expansion differences, especially in areas with dense through-holes and large surface copper areas, making it important to carefully manage the reflow process and consider alternatives to reduce the risk.
Production of FR4 PCBs faces significant challenges due to extreme heat conditions Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.