Manufacturing

Double-sided PCB Manufacturing Process

In recent years, the main processes for manufacturing double-sided metalized PCB are the SMOBC method and the pattern plating method, with the wire method occasionally used. The SMOBC process is favored for its prevention of solder bridging and consistent lead-tin ratio, while pattern plating remains a traditional method with its own advantages and disadvantages.

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Designing for PCB Testability: A Professional Approach

Effective test strategies are crucial in PCB board design and manufacturing, especially as products become more complex and deadlines tighten. Testing encompasses bare board testing, load testing, production defect analysis, in-circuit testing, functional testing, and a combination of these methods. It is essential to develop a tailored test plan early in the design process to ensure cost-effectiveness and product reliability.

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Attention required in PCB fabrication

The key factors to consider during the PCB manufacturing process include the type of production, PCB material, non-electrical technical indicators of copper clad plate, and precautions for PCB layout.

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Differentiating Heavy Copper PCBs from Standard Copper PCBs

Heavy copper PCBs are commonly used in commercial products due to their high copper concentration, impeccable thermal strength, and ability to carry large currents, making them suitable for high-power transmission in electronic and electrical circuits.

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