The rising demand for FPC flexible circuit boards, driven by the trend towards smaller electronic products, highlights the differences between gold plating and immersion gold in surface technologies.
Comparing FPC Gold Plating and Immersion Gold Processes. Read More »
The advantages of FPC flexible boards, such as being shorter, smaller, lighter, and thinner, are evident with the increasing demand driven by electronic product development. However, common surface defects, like bubbles, often arise due to manufacturing processes. The solution involves ensuring proper screen printing and current control during plating.
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