mechanical properties

Three Key Performance Attributes and Characteristics of FPC Connectors

FPC connectors’ performance is primarily categorized into mechanical, electrical, and environmental aspects, each encompassing critical factors like insertion/extraction forces, contact resistance, and resistance to temperature and humidity.

Three Key Performance Attributes and Characteristics of FPC Connectors Read More »

4 Techniques for Multilayer PCB Identification

Printed Circuit Boards (PCBs) play a crucial role in electronic devices, serving as foundational infrastructure for connecting and transmitting electrical signals among electronic components. They are typically composed of materials like fiberglass and copper foil, offering excellent conductivity and mechanical properties. PCB design considerations include circuit connectivity, layout, and thermal management. Effective PCB layouts can minimize electromagnetic interference and signal delay, thereby enhancing overall device reliability and stability. Strict quality control and production processes are vital during PCB manufacturing to ensure high performance and extended product lifespan, ultimately influencing the overall quality and reliability of electronic devices.

4 Techniques for Multilayer PCB Identification Read More »

Assessing FPC Quality: Criteria for Good vs. Faulty Flexible PCBs

Quality FPC flexible boards must meet size and thickness standards, have proper surface finish and color, exhibit visually appealing weld seam appearance, ensure component functionality, adhere to line specifications, maintain copper adhesion and oxidation resistance, possess electromagnetic compatibility, shape stability, environmental resistance, and mechanical properties.

Assessing FPC Quality: Criteria for Good vs. Faulty Flexible PCBs Read More »

Causes of Cold Soldering Issues in PCB Reflow Soldering Processes

Gold is commonly used in FR4-PCB welding due to its stability, but excessive gold content can weaken solder joint mechanical strength, leading to incomplete reflow and cold welding issues. Various factors such as intermetallic compound formation, base metal composition, reflow parameters, and flux activity can also contribute to these problems.

Causes of Cold Soldering Issues in PCB Reflow Soldering Processes Read More »

Contact

WellCircuits
More than PCB

Upload your GerberFile(7z,rar,zip)