To master high-speed PCB design, it’s crucial to understand transmission lines, which are signal paths with specific impedance that can cause reflections and delays if mismatched, potentially leading to system errors.
To improve PCB EMC performance, techniques such as reducing the power layer size to confine electric fields within the ground plane, adhering to the 3W and 20H principles, and using appropriate methods for separating analog and digital grounds, including 0-ohm resistors, magnetic beads, and capacitors, can effectively reduce interference and enhance signal integrity.
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The 20H principle in PCB design involves reducing the distance between the power and ground layers to enhance electromagnetic compatibility, while the 3W principle requires trace spacing to be three times the trace width; additionally, signal lines are classified into microstrip and strip lines, each with unique characteristics and challenges, as well as strategies for managing analog and digital grounds effectively.
What are the common issues encountered in PCB layout and design? Read More »
A typical PCB transmission line consists of conductive traces, usually copper, embedded in insulating material like FR4, with microstrip and stripline being the two main structures, each having distinct configurations and properties.
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