FFC cables enhance connectivity with customizable designs, reduce electronic product sizes and costs, and are ideal for compact applications due to their excellent electrical properties and thermal resistance, making them suitable for various industries while ensuring reliable operation in demanding conditions.
The rise of miniaturized high-density packaging has heightened demands for precise high-speed PCB assembly, prompting significant advancements in equipment and processes. Flip-chip technology, with its smaller form factor and finer ball pitches compared to BGA or CSP, presents both opportunities and challenges across substrate technology, material compatibility, and manufacturing processes, necessitating careful consideration of factors such as solder ball placement accuracy and machine precision.
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.