Moisture absorption

Reasons for PCB Explosions During Processing and Proposed Solutions

The article outlines common causes of PCB explosions, emphasizing that insufficient heat resistance of substrates, moisture absorption, and low Tg of materials are significant contributors, highlighting the need for improved quality control during production.

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Factors Contributing to PCB Board Explosions During Manufacturing Processes

A PCB explosion board refers to the failure of printed circuit boards due to copper foil blistering, substrate delamination, or other issues caused by inadequate heat resistance and moisture absorption during manufacturing or thermal processing.

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Analysis and Optimization of Burst Plates in PCB Reflow Soldering

This document analyzes PCB board burst phenomena during reflow soldering, detailing the impact of moisture absorption, poor adhesion, inappropriate reflow temperatures, and design flaws, while suggesting improvements for enhanced soldering reliability.

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16-layer Rigid PCB Manufacturer Analyzes Causes of Warpage

The chapter explores PCB warping, highlighting improper substrate storage and production practices as primary causes. Effective prevention involves careful management, especially concerning moisture absorption in copper-clad laminates during storage.

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Distinguishing Between Rogers PCB and FR4 PCB

Cost and performance differences between FR4 and Rogers PCBs impact their suitability for various applications, with FR4 being more cost-effective for low frequency and nominal temperature settings, while Rogers PCB is preferred for high-speed or extreme temperature operations due to its superior impedance stability and thermal management capabilities.

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