This article outlines the critical challenges posed by humidity in printed circuit board (PCB) manufacturing and provides comprehensive strategies to mitigate moisture’s effects throughout the production process.
What factors influence the PCB assembly process? Read More »
Warpage in BGA packages and PCBs, caused by thermal expansion mismatches and heating-cooling cycles, can lead to circuit failures, but can be mitigated through careful temperature control, moisture management, and optimized solder paste application.
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