mounting

Explanation of Flexible Printed Circuit (FPC) Assembly Process

The FPC production process involves careful fixation on carrier boards, specific printing process, SMT, reflow soldering, and precise inspection, requiring attention to detail and specific considerations different from hard circuit boards. Dedicated carrier boards and careful handling are essential for quality and reliability.

Explanation of Flexible Printed Circuit (FPC) Assembly Process Read More »

Components are through-hole mounted on one side and surface mounted on the other.

The individual is inquiring about the potential drawbacks of having through-hole connectors on one side of the board and everything else, such as surface-mounted components, on the other. They are questioning whether this assembly makes selective or wave soldering more challenging and considering consolidating all components on the same side if feasible.

Components are through-hole mounted on one side and surface mounted on the other. Read More »

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