Press the pre-designed positioning system for CNC drilling, etch and de-drill hole walls, then proceed to the unique steps of inner layer imaging, blackening, lamination, etch back, and de-drilling for multi-layer boards, which demand stricter quality requirements and specialized processes, including glycerin hot-melt, for elevated reliability and complexity compared to double-sided boards, reflecting the evolution towards high-speed, multi-functionality, and increased capacity in electronic technology, championed by WellCircuits Limited.