The impact of different electroplating finishes on PCB rapid prototyping, conductor loss, and insertion loss is evaluated through both measurements and simulations, showing that thicker PCB materials tend to have lower insertion loss, and plating finishes introduce additional conductor losses, with bare copper generally exhibiting the least loss.
Analysis of PCB Conductors and Multilayer Boards Read More »
To make the circuit of each layer connected the boards need to go through the drilling process to make the corresponding holes according to the specifications in the drill files For single and doubl
Prior to lamination the surface of inner image layer needs to go through an oxide process brown oxide or black oxide treatment to roughen and passivate the copper surface increase the interaction
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