Before designing a multilayer PCB, the designer must determine the board structure, including the number of layers, layer placement, and laminate structure, to ensure optimal performance, signal integrity, and electromagnetic compatibility.
Printed circuit boards (PCBs) are crucial for electronic devices, with multilayer boards supporting high-density, high-speed circuits, and their design must address electromagnetic compatibility (EMC) issues, signal integrity, and the proper placement of layers, traces, and decoupling capacitors to minimize interference and optimize performance.
PCB Electromagnetic Compatibility (EMC) and Signal Integrity Wiring Design Read More »
The article outlines key principles for high-speed PCB signal line routing, including the selection of appropriate layer counts, minimizing lead bends and lengths, reducing via usage, managing cross interference, implementing ground plane shielding, and proper grounding techniques for both digital and analog circuits to ensure signal integrity and reduce noise.
Multilayer PCB design requires that each trace layer has an adjacent reference layer and that power and ground layers are positioned closely to enhance coupling capacitance, while also focusing on minimizing loop areas of key signals to improve electromagnetic compatibility.
To effectively reduce costs in PCBA production, key factors include optimizing board dimensions, using SMT over through-hole components, managing layer counts, minimizing vias, and understanding the cost implications of different flexible circuit designs.
Where can cost savings be achieved in PCBA production and processing? Read More »
A printed circuit board (PCB) is a crucial component in electronic devices, made from insulating material with conductive patterns that connect various electronic components, and its production involves complex processes and numerous challenges.
Designing a multi-layer PCB requires careful consideration of the board structure, including layer count and arrangement, to optimize electromagnetic compatibility (EMC) and minimize interference, while balancing routing capabilities and manufacturing complexity.
Concerning the selection of the PCB design stack-up structure. Read More »
For high-frequency circuit design, use multilayer boards, minimize lead bends and lengths, reduce vias, manage crosstalk with proper spacing and grounding, add decoupling capacitors, and isolate digital and analog grounds to enhance performance and reliability.
Experience in high-frequency circuit board design and routing Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.