Poor soldering in PCB design and production can lead to various defects, often caused by issues like insufficient tinning, contamination, inadequate flux, or improper soldering temperature, and requires proper prevention strategies such as chemical analysis, pre-plating treatment, and temperature control.
Limited understanding of tin usage in PCB circuit boards. Read More »
This article introduces PCB design guidelines for ensuring signal integrity (SI), emphasizing the importance of early SI issue identification, pre-design preparation, proper routing, and collaboration with manufacturers to optimize high-speed node performance, impedance control, and minimize crosstalk, all aimed at achieving efficient, high-quality PCB designs.
PCB Design Guidelines for Ensuring Signal Integrity Read More »
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Wall thickness refers to the distance between a surface to its corresponding surface Generally speaking the thicker the wall thickness of 3D printing the greater the hardness and strength of the pa
Introduction to 3D Printing Wall Thickness – 3D Printing – Wellcircuits Read More »
IntroductionHello all Welcome on board Here we are going to focus on designing a 5V power supply We will design the power supply and carry out and explain how to do various calculations including a
A Complete Guide to 5V DC Power Supply Design – PCB Design Tutorial – Wellcircuits Read More »
Fritzing is a low-barrier-to-entry electronic design automation software for the needs of manufacturers and hobbyistsAt Wellcircuits we recommend our customers provide Gerber in RS-274X format for manufac
How to Export Gerber and Drill Files from Fritzing – A PCB Design Guide – Wellcircuits Read More »
QFN packaging offers advantages like compact size, high yield, and good heat dissipation, making it ideal for high-speed circuits, but it presents soldering challenges due to the leadless design and potential oxidation of side solder joints, requiring specialized inspection and testing methods.
Quality of QFN Package Soldering in PCB Assembly and SMT Processes Read More »
Test points on a PCB are necessary to safely and efficiently verify the functionality and solderability of components using automated test equipment, preventing damage to sensitive parts during the testing process.
The PCB cloning process involves scanning the original board, documenting component placements, creating a PCB layout file using specialized software, and then manufacturing and testing the cloned board to ensure it matches the original in performance.
The steps involved in PCB reverse engineering are as follows: Read More »
The article outlines key principles for high-speed PCB signal line routing, including the selection of appropriate layer counts, minimizing lead bends and lengths, reducing via usage, managing cross interference, implementing ground plane shielding, and proper grounding techniques for both digital and analog circuits to ensure signal integrity and reduce noise.
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