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Screen Printing Process in PCB Manufacturing

Advancements in PCB screen printing technology and materials have improved both the manufacturing process and testing equipment, enhancing the effectiveness of high-density PCB production and enabling three key applications: solder resist layers, graphic transfers, and surface markers.

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Potential PCB Quality Issues in PCB Fabrication

PCB manufacturing quality issues primarily involve soldering defects, adhesive strength problems, and excessive size changes. Soldering issues often cause blasting holes and cold solder spots due to poor copper plating or trapped volatilized materials. Adhesive problems result in pad detachment due to poor soldering techniques or material properties. Size changes occur due to structural texture oversight or incomplete stress release in laminates.

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Could you explain what wave soldering is?

Wave soldering is a highly automated and efficient process used to solder electronic components to printed circuit boards, suitable for large-scale production and various applications in electronics, automotive, medical, and consumer products.

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Surface mount vs Through hole

Surface mount technology (SMT) is a faster, more efficient method for attaching electronic components directly to the surface of a PCB, offering benefits like miniaturization, high performance, and automation, whereas through-hole technology (THT) involves inserting components through holes for more mechanical strength but is generally slower and more costly.

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