The choice of PCB surface treatment processes depends on the final assembly components, with five common methods including hot air leveling, organic coating, electroless nickel/immersion gold, immersion silver, and immersion tin, each offering specific advantages and limitations for different applications.
Typical Applications of PCB Surface Treatment Processes Read More »
Common PCB surface treatment processes include lead-free or leaded tin spraying, hot air leveling (HAL), organic coating (OSP), chemical gold plating (electroless nickel/immersion gold), electroplating nickel gold, immersion silver, immersion tin, and halogen-free gold finger. Environmental concerns are driving a shift away from leaded processes towards lead-free options like tin spraying to comply with ROHS standards, crucial for passing audits and securing long-term product development partnerships. These treatments alter PCB components’ properties to ensure solderability and prevent oxidation, crucial for reliable electrical connections.
The evolution of PCB surface treatment technology, influenced by environmental concerns and evolving industry standards, emphasizes lead-free and halogen-free processes like organic coating and electroless nickel plating/immersion gold, while also considering factors like component type and assembly requirements, leading to a dynamic landscape of options with a focus on meeting customer needs and environmental standards.
The choice of surface treatment process for PCBs depends on the type of components and desired final use, with options including hot air leveling, organic coating, and others.
The surface treatment of PCB plays a crucial role in ensuring good solderability and electrical properties, and as environmental concerns increase, the industry is moving towards lead-free and halogen-free processes. Hot air leveling and organic coating are two common surface treatment processes, each with its unique characteristics and benefits in protecting the copper surface.
Characteristics and Development Trends of PCB Surface Treatment Processes Read More »
The choice of surface treatment process for PCBs depends on the type of components and desired final use, with options including hot air leveling, organic coating, and others.
The surface treatment of PCB plays a crucial role in ensuring good solderability and electrical properties, and as environmental concerns increase, the industry is moving towards lead-free and halogen-free processes. Hot air leveling and organic coating are two common surface treatment processes, each with its unique characteristics and benefits in protecting the copper surface.
Characteristics and Development Trends of PCB Surface Treatment Processes Read More »
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