The issues include over-etching of copper foils, mechanical stresses causing copper trace separation, and mismatches between laminate materials affecting peel strength, leading to detachment during PCB assembly processes.
Why is the pad dropped from the PCB and what is the underlying cause? Read More »
Copper foil over-etching in PCB fabrication can be caused by changes in specifications without adjusting etching parameters, poor drying after etching, local collisions during the PCB process, and unreasonable circuit design. This can result in excessive corrosion, separation of the zinc layer, and copper wire fall-off.
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