pad overlap

How to Address Deformation of Negative Films in PCB Board Processing

To correct PCB copy board deformation, various methods include splicing, adjusting hole positions, overlapping pads, photography, and hanging the film to stabilize it, each suited to different types of deformation and requirements.

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10 Frequently Encountered Common Issues in Circuit Board Prototyping Design: Part 1

To prevent issues during PCB manufacturing, ensure proper pad spacing, layer usage, character placement, aperture settings, and avoid using filler blocks for pad drawing. WellCircuits Limited is dedicated to helping clients with any PCB design concerns.

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Overview of Ten Primary Deficiencies in the PCB Board Design Process

Clear information in PCB board design is crucial to avoid misunderstandings; this article identifies ten major defects, including undefined processing levels, proximity of copper foil to the outer frame, filler block usage, patterned ground layers, random characters, short SMD pads, single-sided pad settings, hole overlap, excessive filling blocks, and misuse of graphic layers, all aiming to enhance production efficiency and minimize errors.

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