Manufacturing Process of Locally Buried Daughter Board PCB

Partially buried daughter board technology reduces material costs in multi-structure PCB manufacturing, yet challenges like processing bypass difficulties, alignment issues, glue overflow, and board warping persist. This article proposes solutions such as improved daughter board corner alignment, precise copper cutting to control overflow, and optimized laminate structure to mitigate warping, aiming to enhance product quality and yield amidst rising raw material prices.

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