The double-sided PCB manufacturing process includes methods like SMOBC (Solder Mask Over Bare Copper) and pattern plating, with key steps such as electroless copper plating, lead-tin stripping, hole plugging, and hot air leveling, aimed at improving solderability, reliability, and circuit integrity.
How are double-sided printed circuit boards (PCBs) manufactured? Read More »
The semi-additive method for precision fine wire technology involves electroless copper deposition, dry film application, pattern plating, and etching, enabling production of thinner and closely spaced lines with minimal side etching or distortion, requiring proficiency in electroless thick copper and graphic plating technologies.
Advanced Technology in PCB Multilayer Circuit Boards: Part 4 Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.