PCB boards are essential electronic components used across various industries, providing electrical connectivity and supporting components, with 4-layer and 6-layer boards being the most common.
What processes does PCB board corrosion undergo? Read More »
PCBs are critical components in electronic products, pivotal for signal transmission and housing various elements. Their quality directly impacts device performance. Evolving towards higher density and environmental sustainability presents challenges like production failures, necessitating rigorous failure analysis to identify causes, propose solutions, and ensure accountability.
To ensure PCB board quality and reliability amidst production challenges, employing established failure analysis techniques is essential. This article summarizes ten common techniques to address these issues effectively.
Encyclopedia of PCB Board Failure Analysis Technology Read More »
A classic PCB board temperature profiling system includes a data collection profiler traversing the furnace center to gather PCB temperature data via affixed Type K thermocouples. Insulation shields the thermocouples from furnace heat, with software analyzing data to assess soldering outcomes and detect adverse trends, crucial for maintaining final PCB product quality.
Traditional PCB Temperature Profile of System Components Read More »
PCB boards have evolved from the development of copper plating on borehole walls in the 1950s, to the use of multilayer and flexible PCBs, driving the dynamic growth of the industry.
Tin appearance on PCB boards post-wave soldering may arise from various factors beyond just design flaws. Issues like inadequate flux activity, uneven application, or uncontrolled solder temperature can contribute. While not all issues stem from design, designers must ensure correctness. To mitigate tin formation, focus on flux activity, wettability, and solder temperature during wave soldering.
Today’s CMOS technology allows a single FPGA device to have multiple I/O interfaces, and it is crucial for FPGA users to accurately measure and quantify system-level SSN on the PCB board. This article provides a comprehensive introduction to SSN, with a specific focus on SSN caused by FPGA output buffering, and presents several PCB board design techniques that can effectively reduce SSO.
Analysis of Synchronous Switching Noise Generated by FPGA on PCB Read More »
The statement can be summarized as follows: “Non-electrolytic nickel coating on PCB boards serves multiple functions, including facilitating gold deposition, establishing strong connections, and preventing solder issues due to oxides or contaminants. Nickel’s purity is crucial for gold precipitation, with a balance of phosphorus content ensuring desired properties. Hardness matters for physical strength, especially in automotive applications. Copper is preferred for circuits, while gold’s conductivity is valuable for outer layers. Nickel’s thickness can impact high-frequency signals, and contact resistance is vital for long-term conductivity.”
Specifications for non-electrolytic nickel plating on PCBs Read More »
Minimum distances between PCB board components should be set to avoid damage and ensure proper functioning.
Precautions to Take During the PCB Manufacturing Process Read More »
Before PCB mass production, customers need to provide detailed parameters for prototype creation, which helps assess manufacturer capabilities, minimize defects, and establish a foundation for future production. This includes sheet selection guidelines, thickness descriptions, copper skin thickness, solder mask color specifications, special production requirements, dimensional tolerances, sample quantities, and imposition requirements.
What are the essential parameters that manufacturers require for PCB prototyping? Read More »
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