During SMT patch processing, factories must install suitable temperature and humidity meters, maintain specific environmental conditions, ensure cleanliness, and meet air source, exhaust, and lighting requirements.
Thermohygrometer for SMT Soldering Process Monitoring Read More »
The practical application of the PCB thermoelectric phenomenon in temperature measurement relies on the Seebeck effect, which allows thermocouples to detect temperature differences through the thermoelectric potential between their electrodes, although advancements in electronics are shifting preference towards resistance thermometers in the PCB industry.
Thermocouple Testing Techniques for PCB Thermal Design Read More »
For most circuit boards, efficient panelization during PCBA processing is critical, optimizing production efficiency and minimizing material wastage through methods like two-in-one or Yin-Yang configurations, crucial for cost-effective manufacturing.
Various issues in PCBA board design and fabrication Read More »
The choice of 50 ohms for PCB trace impedance is a well-established compromise based on historical standards, manufacturing convenience, minimal skin effect loss, and practical electrical performance considerations, though it’s not a one-size-fits-all solution.
Summary: Standard PCB manufacturing guidelines include minimum trace spacing of 4 mils, minimum pad aperture of 0.2 mm for mechanical drilling and 4 mils for laser drilling, minimum pad width of 0.2 mm, minimum pad-to-pad spacing of 0.2 mm, and copper clearance of at least 0.3 mm from board edges, with a recommended 20 mil inward shrinkage to prevent mechanical and electrical issues.
PCB Electrical and Non-Electrical Safety Clearance Read More »
Partially buried daughter board technology reduces material costs in multi-structure PCB manufacturing, yet challenges like processing bypass difficulties, alignment issues, glue overflow, and board warping persist. This article proposes solutions such as improved daughter board corner alignment, precise copper cutting to control overflow, and optimized laminate structure to mitigate warping, aiming to enhance product quality and yield amidst rising raw material prices.
Manufacturing Process of Locally Buried Daughter Board PCB Read More »
Our experience lies in creating multiple-layer, flexible circuits and rigid-flex PCBs HDI PCBs as well as Rogers PCBs.
We have a great track record in fast-turnaround prototyping of PCBs, and excel at managing challenging projects as a strength.