The PCB design process involves component parameter setup, schematic input, manual placement and routing, verification, review, and output, while emphasizing trace spacing, layout optimization, grounding, and careful design review to ensure electrical safety and performance, especially in high-frequency switching power supplies.
The article outlines design specifications for part placement during wave soldering, emphasizing the importance of component orientation, placement strategies, and considerations for both through-hole and SMD components to prevent issues during the soldering process.
PCBA: Component Placement Optimization for Wave Soldering Read More »
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