PCB defects

Temperature and Humidity Requirements for PCB Manufacturing Environment

Controlling environmental conditions, such as temperature and humidity, in PCB manufacturing is crucial for preventing defects like solder bridging, solder balls, and poor joint quality, with proper monitoring and equipment like humidity sensors and air conditioning systems being essential to maintain optimal conditions.

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What are the causes of copper delamination in PCB circuit boards?

In PCB production, copper rejection—poor adhesion of copper wires—can arise from manufacturing process issues, laminate manufacturing flaws, or incompatible raw materials, all negatively affecting product quality.

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What makes Solder Paste Inspection so important – WellCircuits

SPI or solder paste inspection is a technical procedure to analyze or inspect solder paste deposits in a printed circuit board or PCB. This analysis takes place during the manufacturing process. Solder paste inspection examines PCB defects like solder percentage, the quantity of solder, missing solder, and the like.xa0 Hence,…

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