Blind Hole Fabrication: Essential Insights
The key to enhancing PCB density lies in minimizing through-holes and implementing precise setups for blind and buried holes, ensuring efficient production processes and electrical connectivity.
PCB density
“PCB Production of HDI Blind Hole Boards”
The demand for high-density circuit boards drives the evolution towards High-Density Interconnect (HDI) technology by minimizing through-holes and implementing precise blind and buried vias, while considering factors like laser hole sleeving and film formatting.