PCB drilling includes through holes, blind holes, and buried holes, with vias serving as electrical connections between layers, where blind and buried vias optimize space and conductivity, but are more complex and costly to manufacture.
Understand the three types of drilling processes in PCB fabrication. Read More »
The use of phenolic resin and Bakelite boards as backing materials in PCB drilling, detailing their properties, types, and functions in the PCB production process, as well as BGA processing techniques for PCB copy board technology.
Backing board for PCB drilling and BGA processing techniques Read More »
The article examines how advancements in technology and industry impact PCB drilling, highlighting key factors such as equipment quality, material issues, operating conditions, and nozzle control, while also considering the challenges of drilling size ratios and secondary drilling.
What are the key factors that influence PCB board drilling? Read More »
Multilayer PCBs, used to accommodate dense component placement, involve a complex production process that includes print and etch, post-etch punch, and drill and panel-plate methods, with careful attention to material preparation and copper surface treatment.
Inner Layer Fabrication Techniques and Processes in PCB Manufacturing Read More »
PCB drilling is a crucial process in PCB manufacturing, involving through hole, blind hole, and buried hole drilling, which are essential for connecting circuits in different layers of the board and ensuring the board’s usability and functionality.
Three commonly used types of PCB drilling techniques Read More »
With the rapid development of the electronic industry, PCBs are evolving towards high density and precision, with different types of drilling holes emerging to meet production needs, such as through holes, blind holes, and buried holes. In high-speed PCB design, efforts can be made to reduce the adverse effects of parasitic effects caused by vias, such as choosing reasonable via hole sizes, using thinner PCB boards, minimizing unnecessary vias, and optimizing the placement of power and ground vias.
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