Many PCB manufacturers continue using wet film imaging due to cost, which can cause issues like “seepage” during pure tin electroplating; this article offers solutions and outlines the electroplating process while emphasizing the importance of proper wet film handling and process control.
Are you aware of the defects associated with electroplated pure tin on PCBs? Read More »
Copper sulfate electroplating is crucial for PCB manufacturing and controlling the quality of acid copper electroplating is a challenging but key aspect, with common issues including rough plating, copper particles on the board surface, and dissolving/accelerating issues, which can be mitigated through various solutions and preventive measures.
Failure in copper electroplating on PCB system board Read More »
The use of through-holes within pads in modern PCB design enhances component density, thermal management, and signal integrity by minimizing signal path length through advanced electroplating and epoxy filling techniques.
Could you provide details on the VIPPO technology? Read More »
Poor plating during PCB electroplating can be attributed to mold contamination, moss pollution, high porosity, inconsistent coating thickness, black spots caused by leaking hanger packages, workpiece discoloration, tin tumors, and color variations due to improper chemical reactions.
Reasons of Poor Plating During PCB Electroplating Read More »
Poor plating during PCB electroplating can be attributed to mold contamination, moss pollution, high porosity, inconsistent coating thickness, black spots caused by leaking hanger packages, workpiece discoloration, tin tumors, and color variations due to improper chemical reactions.
Reasons of Poor Plating During PCB Electroplating Read More »
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